Shenzhen Insun Intelligent Technology Co., Ltd. is a precision and intelligent high-tech enterprise which specializes in the research, manufacture and sale of high-end intelligent 3D detection technology (AOI, SPI), Semiconductor detection technology, Laser intelligent application technology, High-speed dispenser and Industrial robot integration technology. The company mainly provides research, development, production, sales and after-sales for high-end electronic manufacturing industry.
The core technologies include: Automatic optical inspection for semiconductor chip packaging, COF carrier fine lines, Integrated circuit surface printing and mounting and other related fields, advanced laser engraving technology and application, etc.
The company has established an independent R&D center, focusing on hardware and software development. The core staff of the center's technology and management team have more than decades of industry experience and rich theoretical and practical experience. It embodies strong creativity and innovative spirit. And achieved more than 50 patents including invention patents, utility models and design.
The Group has its own sheet metal, precision machinary production to ensure process quality and delivery advantages.
Meanwhile, the equipment assembly workshop adopts dust-free and anti-static rule policy, and the internal production management organizes process management according to LEAN standard.
All the service engineers is from lean assembly workshop,accuratedly identify software and hardware fault. we have 7*24H hotline 400 6129 299 for overseas online question diagnosis and resolution. One year warranty and lifelong maintenance for all the customer.
Whole Process Quality Management, Combining resources and processes, the system management is carried out by process management method. According to its own characteristics, a documentation and quantification management system covering the whole process of determining customer needs, designing, developing, producing, testing, selling and delivering is selected. Effectively and comprehensively meet the internal quality management requirements and market quality requirement. The core components purchasement, sourcing from international wellknown brands to gurantee the precision of machine system and an ontime delivery system based on pull production mode
Start and design the first 3D SPI solder paste test equipment in the United States in March 2006
New 3D SPI Solder Paste Testing Equipment was launched in Aug 2008
Start to research AOI automatic optical testing equipment in 2009
AOI Automatic Optical Testing Equipment Launched in April 2011
Full-automatic laser engraving equipment launched in Sep 2013
High-speed dispensing equipment will be launched in 2014
Shenzhen office was set up in June, to officially enter the Chinese market.
Local corporation was registered in Shenzhen, China, full access to china market.
INSUN R&D center was set up in Shenzhen, Nanshan high-tech zone. Cooprated with Shenzhen University to research semiconductor chip packaging, COF tape fine lines.
SPI, AOI, laser engraving, hardware compatible design updated and get goodfeedback from market.
3D AOI was offically launched to market in June 2019, marks a new ste of Chinese visual inspection.
INSUN high precision semiconductor roll pair winder and distributor project participated in international electronic circuit exhibition for the first time, and comprehensively promoted to domestic and foreign markets.
